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PDC Round shape
Polycrystalline Diamond Compact
Polycrystalline Diamond Compact (PDC) of Supreme Company is sintered with diamond and WC under ultrahigh pressure and temperature. It integrates the advantages of diamond and WC, with both extremely high wear resistance and excellent shock strength. Polycrystalline Diamond Compact standard specification of Supreme Company is round and other special specifications can be made according to customers’ requirements. Be suitable for manufacturing all kinds of drilling tools, such as oil, geological and engineering drilling bits.
Round shape
For round shape, we have three series which are listed as below.
SSI Series Polycrystalline Diamond Compact adopts flat tine junction plane. The thickness of diamond layer is about 0.8~1.2mm. It is mainly used in stone processing and hole (blind hole) can be punched according to customers’ requirements.
SSII Polycrystalline Diamond Compact adopts slotted junction plane. Thickness of diamond layer is about 1.2~2.0mm.
SSIII Series Polycrystalline Diamond Compact adopts new net-slotted junction plane, which better removes internal stress of polycrystalline diamond compact; meanwhile the thickness of diamond layer is incre
Polycrystalline Diamond Compact (PDC) of Supreme Company is sintered with diamond and WC under ultrahigh pressure and temperature. It integrates the advantages of diamond and WC, with both extremely high wear resistance and excellent shock strength. Polycrystalline Diamond Compact standard specification of Supreme Company is round and other special specifications can be made according to customers’ requirements. Be suitable for manufacturing all kinds of drilling tools, such as oil, geological and engineering drilling bits.
Round shape
For round shape, we have three series which are listed as below.
SSI Series Polycrystalline Diamond Compact adopts flat tine junction plane. The thickness of diamond layer is about 0.8~1.2mm. It is mainly used in stone processing and hole (blind hole) can be punched according to customers’ requirements.
SSII Polycrystalline Diamond Compact adopts slotted junction plane. Thickness of diamond layer is about 1.2~2.0mm.
SSIII Series Polycrystalline Diamond Compact adopts new net-slotted junction plane, which better removes internal stress of polycrystalline diamond compact; meanwhile the thickness of diamond layer is incre